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 M5243BFP
3-element 2-ch Graphic Equalizer IC
REJ03F0082-0100Z Rev.1.0 Sep.22.2003
Description
This 2-ch, 3-element graphic equalizer IC is ideal for Hi-Fi audio devices, and features three transistor-type resonance circuits and an output operating amp that handles two channels built into it. It is designed for use in radio cassette players, car stereos, portable stereos and other devices.
Features
* Two-channel (stereo) processing is possible with single IC. * An internal reference voltage circuit eliminates the need for a large-volume capacitor and makes it possible to use fewer components. * The Gv can be varied using an external resistor. * Low noise ........................... VNO FLAT = 4 Vrms (standard) * Low distortion .................... THD = 0.004% (standard) (@f = 1 kHz, FLAT)
Recommended Operating Conditions
Rated power dissipation : 550 mW (FP)
System Configuration
Rev.1.0, Sep.22.2003, page 1 of 10
M5243BFP
Block Diagram
Pin Configuration
Rev.1.0, Sep.22.2003, page 2 of 10
M5243BFP
Absolute Maximum Ratings
(Unless otherwise noted, Ta = 25C)
Symbol Vcc ILP Pd Topr Tstg Item Power supply voltage Current load Internal power dissipation Ambient operating temperature Storage temperature Conditions Rated values 16 30 550 -20 to +75 -55 to +125 Unit V mA mW C C
Rev.1.0, Sep.22.2003, page 3 of 10
M5243BFP
Electrical Characteristics
(Unless otherwise noted, Ta = 25C)
Symbol Icc Gv (FLAT) Gv (BOOST) Gv (CUT) Item Circuit current Voltage gain Measurement conditions Flat Boost V1 = -10dBm V1 = -10dBm Vi = 0 dBm Rg = 4.7k Limits f (Hz) -- 1k 100 1k 10k 100 1k 10k 1k 1k 1k 120 -- Min. 9.0 -2.0 10.0 10.0 10.0 -14.0 -14.0 -10.0 -- 1.5 60 55 -- Typ. 12.5 -0.5 12.0 12.0 12.0 -12.0 -12.0 -12.0 0.003 1.9 75 65 3.5 Max. 16.0 1.0 14.0 14.0 14.0 -10.0 -10.0 -10.0 0.1 -- -- -- 15 % Vrms dB dB mA dB Unit
Cut
THD VOM C.C H.R VNO
Total harmonic distortion Maximum out put voltage Channel separation Hum rejection Output noise voltage
Vi = 1Vms All FLAT THD = 0.1% All FLAT V1 = -10 dBm All FLAT V1 = -10 dBm All FLAT All FLAT BW: 10 Hz to 30 kHz
Vrms
VM
Midpoint potential
--
3.5
4.5
5.5
V
Rev.1.0, Sep.22.2003, page 4 of 10
M5243BFP
Test Circuit
Rev.1.0, Sep.22.2003, page 5 of 10
M5243BFP
Switch matrices
Item Circuit current Icc RSW 1 - RSW 2 1or 2 Volt age gain Gv (FLAT) Gv (BOOST) ch1 ch2 ch 1 100 Hz 1 Hz 10 Hz ch 2 100 Hz 1 Hz 10 Hz Gv (CUT) ch 1 100 Hz 1 Hz 10 Hz ch 2 100 Hz 1 Hz 10 Hz Maximum output voltage VOM ch2 Total harmonic distortion THD (FLAT) ch2 Output noise voltage VNO (FLAT) ch2 Channel separation CS Hum rejection HR ch1 ch2 ch1 ch2 Midpoint potential VM ch1 ch2 5 3 4 5 5 6 6 2 1 2 1 2 3 3 OFF ON ON OFF OFF OFF OFF - 2 - 2 - - - - 2 - 2 - - - 2 - - - - 2 2 - 2 - 2 - - 2 - 2 - 2 - - 2 - 2 - 2 - - ch2 ch1 ch2 ch1 ch2 ch1 ch2 ON ON ON ON ON ON ON OFF OFF OFF ON ON OFF OFF ch1 2 5 2 1 ON OFF - 2 - 2 - 2 2 - 2 - 2 - ch2 ch1 ON ON OFF OFF ch1 2 1 2 1 ON ON - 2 - 2 - 2 2 - 2 - 2 - ch2 ch1 ON ON OFF OFF BOOST: Set SW2SW4 to 1.CUT: SW4 to 3. ch1 1 2 1 1 1 2 2 2 1 1 1 2 2 2 1 1 2 1 1 1 2 2 2 1 1 1 2 2 2 1 ON ON ON ON ON ON ON ON ON ON ON ON ON ON ON 2 - 1 2 2 - - - 3 2 2 - - - 2 2 - 2 1 2 - - - 2 3 2 - - - 2 2 - 2 2 1 - - - 2 2 3 - - - 2 - 2 - - - 1 2 2 - - - 3 2 2 - - 2 - - - 2 1 2 - - - 2 3 2 - - 2 - - - 2 2 1 - - - 2 2 3 - ch1 ch2 ch1 ch1 ch1 ch2 ch2 ch2 ch1 ch1 ch1 ch2 ch2 ch2 ch1 ON ON ON ON ON ON ON ON ON ON ON ON ON ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF SW 1 - SW 2 - SW 3-1 - SW 4-1 - SW 2-2 - SW 3-2 - SW 4-2 - SW 5 - SW 6 OFF SW 7 OFF Remarks
Rev.1.0, Sep.22.2003, page 6 of 10
M5243BFP
Typical Characteristics
Rev.1.0, Sep.22.2003, page 7 of 10
M5243BFP
Application Example
1. 3-Element graphic equalizer (Dual channel)
Rev.1.0, Sep.22.2003, page 8 of 10
M5243BFP 2. Simplicity 4-element graphic equalizer (Dual channel)
Rev.1.0, Sep.22.2003, page 9 of 10
M5243BFP
20P2N-A
JEDEC Code - e b2
11
MMP
Weight(g) 0.26 Lead Material Cu Alloy
Plastic 20pin 300mil SOP
EIAJ Package Code SOP20-P-300-1.27
Package Dimensions
20
HE
E
L1
L
Rev.1.0, Sep.22.2003, page 10 of 10
e1
Recommended Mount Pad Symbol
10
1
F A
G
D
b
A2 x
M
A1
e y
A A1 A2 b c D E e HE L L1 z Z1 x y c
z Detail G Detail F
Z1
b2 e1 I2
Dimension in Millimeters Min Nom Max - - 2.1 0.2 0.1 0 - - 1.8 0.5 0.4 0.35 0.25 0.2 0.18 12.7 12.6 12.5 5.4 5.3 5.2 - - 1.27 8.1 7.8 7.5 0.8 0.6 0.4 - - 1.25 - 0.585 - - - 0.735 - - 0.25 - - 0.1 - 8 0 - - 0.76 - - 7.62 - - 1.27
I2
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon 1.0


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